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NXP Semiconductors
IP4358CX6
Quad channel low capacitance ESD protection
7. Package outline
WLCSP6: wafer level chip-size package; 6 bumps (2 x 3)
D
bump A1
index area
A 2
E
A
A 1
detail X
e
b
C
e
European
projection
B
A
1
2
e 1
X
wlcsp6_2x3_po
Fig 5.
Table 5.
Package outline IP4358CX6 (WLCSP6)
Dimensions of IP4358CX6 for Figure 5
Symbol
A
A 1
A 2
b
D
E
e
e 1
Min
0.57
0.18
0.39
0.21
0.71
1.11
-
-
Typ
0.61
0.20
0.41
0.26
0.76
1.16
0.4
0.8
Max
0.65
0.22
0.43
0.31
0.81
1.21
-
-
Unit
mm
mm
mm
mm
mm
mm
mm
mm
IP4358CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 October 2010
? NXP B.V. 2010. All rights reserved.
6 of 11
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